Pulido, Jonathan C. and Jr., Edwin M. Graycochea and Gomez, Frederick Ray I. (2020) Elimination of Crumpled Leadframe Defect through Machine Sensor Enhancement. Journal of Engineering Research and Reports, 19 (2). pp. 16-19. ISSN 2582-2926
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Official URL: https://doi.org/10.9734/jerr/2020/v19i217226
Abstract
The paper focused on the improvement done in quad-flat no-leads (QFN) leadframe package assembly to address the quantity of rejection of crumpled leadframe during handling at wirebond process station. Overload sensor at the output magazine handler was found out to be defective, hence a new sensor was installed. With the improvement done, crumpled leadframe strip occurrence was ultimately eliminated.
| Item Type: | Article |
|---|---|
| Subjects: | Open Archive Press > Engineering |
| Depositing User: | Unnamed user with email support@openarchivepress.com |
| Date Deposited: | 31 Mar 2023 05:40 |
| Last Modified: | 28 May 2024 05:12 |
| URI: | http://library.2pressrelease.co.in/id/eprint/695 |
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